Tuesday, March 18 | 10:00 am-11:30 am

Presentation: High Voltage Temperature-Humidity-Bias Testing of Electronic Materials on the Outer Layer of a PCB – A Round Robin Study and Beyond

Presentation: An Industry Survey to Report and Compare the Understanding of Failure Mechanisms of and Protection Measures Against High Voltage Induced Damages To PCB

Presentation: Understanding PCB Failure Mechanisms Under High Voltage and Condensing Conditions

Tuesday, March 18 | 10:00 am-12:00 pm

Presentation: Methods Used to Qualify Soldering and Cleaning Materials and Processes

Presentation: From the Corrosion to Short Circuiting in Electronics: Investigation of The Detrimental Dendrite Development

Presentation: Investigating the Interplay of Ionic Process Contamination and PCBA Component Design on Water Layer Formation and PCBA Humidity Robustness

Presentation: Understanding the Crucial Role of Solder Flux Chemistry in Enhancing Humidity Robustness of Electronics

Tuesday, March 18 | 10:00 am-11:30 am

Presentation: A Universal AI-Powered Segmentation Model for PCBA And Semi-Conductor

Presentation: Unlocking the Promise of AI in Electronics Manufacturing

Presentation: A Method for Real-Time Rejection of Defective Components During the Pick and Place Process Using AI Technology

Tuesday, March 18 | 10:00 am-12:00 pm

Presentation: Pure Palladium Plating for ENPIG – How Bath Properties Impact the Process Handling and Final Finish Performance

Presentation: A Review of Current and Future PCB Final Finishes

Presentation: Ultra-Thin Gold Over Nickel (UTG) The Complete Electrolytic Finish for PCBS

Presentation: Cutting-Edge Pulse Plating Solutions for Uniform Deposition of Copper With Enhanced Reliability in State-Of-The-Art Server Technology

Tuesday, March 18 | 10:00 am-12:00 pm

Presentation: Alternative Methods in Measuring BGAs for Thermal Warpage

Presentation: Detection of HiP of Burn-in FCBGA by Thermal Cycle

Presentation: Solder Graping Issue Analysis

Presentation: Early Defect Detection with a Scalable Broad-Spectrum Test Using Radiofrequency Reflectometry

Tuesday, March 18 | 2:00 pm-3:00 pm

Presentation: Achieving Lower Voids with New Preform Flux Technology

Presentation: Influence of Cleaner Saturation on the Wash Efficiency Under Bottom Terminated Components

Tuesday, March 18 | 2:00 pm-3:00 pm

Presentation: The Economics of Electronic Component Salvage and Reuse

Presentation: Innovative and Cost-effective BGA Re-balling. A New High-Quality Automatic Process Integrated into an All-In-One SMT Equipment of Essemtec

Tuesday, March 18 | 2:00 pm-3:00 pm

Presentation: Fatigue Evaluation of FPC Under Torsional Bending for Wearable Devices

Presentation: Research and Improvement of Manufacturing Difficulty in Narrow Cap of Rigid-Flex PCB

Tuesday, March 18 | 2:00 pm-3:00 pm

Presentation: Implementing IPC-1782 External Traceability for Trusted Material Provenance Across the Supply Chain

Presentation: Process Traceability in Hand Soldering, Rework and Repair – The Missing Link

Tuesday, March 18 | 2:00 pm-3:00 pm

Presentation: Density Substrates for Chiplet Technologies

Presentation: Effects of Tooling Population on Registration Accuracy for Imaged Features of UHDI Substrates

Tuesday, March 18 | 3:30 pm-4:30 pm

Presentation: Glass Type Comparison

Presentation: Extended Analysis of Temperature Behavior of FR4 Substrates when Processing During Laser Depaneling

Presentation: Design and Performance Study of Low Carbon Footprint Bio-based Copper Clad Laminates

Tuesday, March 18 | 3:30 pm-4:00 pm

Presentation: Warpage mitigation, Board Assembly and Solder Joint Reliability for Antenna-in-Package targeted for 6G applications at 92-100 GHz

Presentation: Reliability and Loss Properties of Copper Foils for 5G Applications

Tuesday, March 18 | 3:30 pm-4:30 pm

Presentation: The Human Edge in Digital Manufacturing Beyond Automation - The Role of People in Industry 4.0 

Presentation: CFX drives the digital strength of the industry and leads the new era of intelligent manufacturing

Presentation: A Methodology for Performance Evaluation on Retrieval-Augmented Generation for Engineering Document Summarization

Tuesday, March 18 | 3:30 pm-4:30 pm

Presentation: Large Panel Substrate and PCB Manufacturing Comparisons Between MSAP, SAP, and FAP Processing 

Presentation: An Additive Process to Manufacture Circuitry

Presentation: Capabilities and Challenges in Taking the Step from HDI to Advanced HDI

Tuesday, March 18 | 3:30 pm-4:30 pm

Presentation: Variable Angle Screen Printer Head/Squeegee Benefits and Advantages 

Presentation: Revolutionizing SMT Printing: Enhancing Yields Through Optimized Contact Time, Sequence, and Fluid Dynamics

Presentation: Optimization of Solder Paste Printing for Ultra-High-Density-Interconnect (UHDI) Applications

Wednesday, March 19 | 9:30 am-11:30 am

Presentation: Wearable Device Friendly Light and Moisture Dual Curable Conformal Coating

Presentation: Advanced Corrosion Protection for Electronics using ALD+ Parylene Multilayer Nanocoatings

Presentation: Evaluating Ruggedizing Polymers: Insights from Condensing Environmental Conditions

Presentation: Revolutionizing PCB Encapsulation: The Sustainability and Savings of Flood Coat Technology

Wednesday, March 19 | 9:30 am-11:30 am

Presentation: Enhancing PCB Reliability: Voiding Reduction Techniques for Mixed Alloy Solder Pastes

Presentation: Evaluating the Enhancements in Reliability Achieved Through the Integration of Polymer Reinforcement and Solder Alloy Materials in Board-Level Assemblies

Presentation: Novel supercooled solder materials for lower-than-liquidus reflow

Presentation: Exploring the Feasibility and Challenges of a  Low Temperature Alloy in Wave Soldering Applications

Wednesday, March 19 | 9:30 am-11:30 am

Presentation: Design Considerations for Sustainable Printed Circuit Boards

Presentation: A Comprehensive Sustainability Comparison of Primary Metallization Processes

Presentation: A Novel Fully Recyclable and Biodegradable PCB Material with a Drastically Reduced Carbon Footprint for Single Use and Short Lifetime Applications

Presentation: An AI approach to leveraging Lifecycle Assessments for Ecodesign

Wednesday, March 19 | 9:30 am-11:30 am

Presentation: Conformally Coated QFN Assemblies under TC and a New HALT

Presentation: Spring-Probe Technologies for End-of-Line Test. History, Design and Latest Trends & Applications

Presentation: Futureproof PCBA Test with a Multi-Test Approach for Reduced Takt Time

Presentation: 3D X-ray of CTBA228 Assembly from –100℃ to 105℃

Wednesday, March 19 | 9:30 am-11:30 am

Presentation: Copper Salt-Based Sinter Paste for Use Under Air and Pressureless Conditions

Presentation: Thermal Characterization of Top Side Contacts in Ceramic Encapsulation Material for High Power Density Applications

Presentation: Flux technology Development for Solder Paste Compatible with Formic Acid Reflow Ovens for Power Devices

Presentation: Novel Thermosetting Material with High Thermal Conductivity, High Insulation Reliability and Demonstration of Heat Dissipation Performance of the PCBs

Wednesday, March 19 | 2:00 pm-3:00 pm

Presentation: Reliability of Micro Vias

Presentation: Reliability and Value Proposition of Active and Passive Embedded Components in Consumer Applications

Wednesday, March 19 | 2:00 pm-3:00 pm

Presentation: High-Performance Phase Change Metal TIMs - Part II

Presentation: Liquid Metal Paste High-Speed Dispensing for High-Volume Manufacturing – Part II

Wednesday, March 19 | 2:00 pm-3:00 pm

Presentation: Flexible Hybrid Electronics Created from a Multicomponent System of Electroless Copper on Laser-Induced Graphene

Presentation: Study on Influencing Factors of Flexibility and Tear Resistance of Flexible Board

Wednesday, March 19 | 2:00 pm-3:00 pm

Presentation: Thermal Profiling of pre-heater configurations with added convection to determine heating effectiveness for selective soldering

Presentation: Influence of Accurate Thermal Profiling on Reflow Process Control

Wednesday, March 19 | 3:30 pm-5:00 pm

Presentation: Direct Digital Manufacturing of Glass Additively Manufactured Electronics

Presentation: Additive printed PCB manufacturing for more sustainable electronics

Presentation: Enhancing Component Density in PCBs: A Study on Molded Interconnect Device Integration

Wednesday, March 19 | 3:30 pm-5:00 pm

Presentation: A Specialized Overlay for Advanced Full-Wave Electromagnetic Simulations within AutoCAD Environment

Presentation: Applying pre-trained ViT model for PCB & Components Image Recognition at Scale

Presentation: Improving THT-AOI Image Classification through Federated Learning: A Study on Model Performance and Training Stability under Various Data Distributions

Wednesday, March 19 | 3:30 pm-5:00 pm

Presentation: The Mechanism of Fill Voiding in Resin Plugged Back-Drilled Hole

Presentation: Investigating Hole-Wall to Hole-Wall Filament Growth Induced by PCB Design Features

Presentation: PTH Via Stub Length Reduction and Control in PCBs

Wednesday, March 19 | 3:30 pm-5:00 pm

Presentation: Printed Circuit Board Challenges for Achieving Signal Integrity at 224Gb/s and Beyond

Presentation: Evaluating PCB Fabrication Capabilities for Compliance with SFF TA-1002 and CEM Connector Specifications

Presentation: Best PCB Design for Manufacturing Practices to Avoid Fabrication Defects